Experienced Packaging Engineer required to take up a Senior Packaging Engineer role within the expanding R&D team of a market leading optoelectronic equipment company.
On offer is the chance to take on a leading role within the R&D function which is involved in technically challenging and high paced development work that has immediate real world application into many of the data centres for the worlds largest internet companies.
Enigma People Solutions is delighted to have been retained by our world leading client that is focused on the R&D and manufacture of optoelectronic equipment used within data-communication centres.
Working to design and manufacture the technology that plugs into the data centres of the largest internet clients in the world, this company is a Scottish success story that you will hear much about in 2018.
They have committed to complete the relocation of all of their R&D function to Livingston, Scotland in order to make Scotland the centre for the design, test and manufacturing of their product.
It is rare these days to be able to design, test and manufacture all on the same site and even more so for this to happen in Scotland so this is a big deal.
Successful candidates will quickly grow to be a key member within the development team and will be directly involved with the design and development of optoelectronic packages and circuits for data rates of 10Gb/s and higher.
Your responsibilities will include but not be limited to:
Mechanical design of high speed (200g, 400g, Tb) optoelectronic modules; design of planar lightwave products.
Work closely with the wider team over multiple sites to deliver products from prototyping to volume manufacturing.
Simulation: thermal, stress, etc.
Component and assembly tolerance. Mechanical debug
Sourcing and verification of prototype and high volume components and assemblies
Design of fixtures / tooling / rigs in support of module development and manufacture
Product data maintenance including models and component / assembly drawing.
Mentor more junior members of staff. Set the standard for professionalism and high quality execution.
Key Knowledge and Skills required:
PDM Enterprise Vault
Comfortable with a range of manufacturing technologies: die casting, injection moulding, wafer fabrication, dicing and polishing, PCBA fabrication, 3d printing, laser marking and cutting, thin and thick film deposition, etc.
Comfortable with a range of assembly technologies: adhesive bonding, solder bonding, flip technology, die bonding, wire bonding, seam sealing, laser welding, etc.
Design for manufacture / design for assembly
Practical hands-on experience, e.g. machine shop modifications
Desirable skills and experience include:
Data Communications industry experience
Optoelectronic design experience
Experience developing optical transceivers
Working in an international company over multiple sites
Verification of simulation results
Comfortable recommending expenditure in £50k+ range
Release of components to volume production environment
Experienced team leader
Familiarity with Lasers, photodiodes and fibres
Understanding of semiconductor concepts
Experience with ceramics
Production Manufacturing experience
Metal stacks for electrical tracks